FOL - Staff Engineer - Development

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JOB OBJECTIVES:

To lead and execute development activities for Front-of-Line (FOL) semiconductor packaging processes, with a focus on continuous improvement, cost efficiency, yield enhancement, and new technology introductions. This role involves cross-functional collaboration to drive process development from concept to qualification and release for mass production.

JOB DUTIES AND RESPONSIBILITIES

1. Power Package and Module Development
  • Lead the end-to-end design and development of high-power discrete and power module packaging technologies.
  • Define product requirements and translate customer needs into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD) .
  • Collaborate with designers and process engineers to define internal/external structure, material selection, and optimized assembly flows.
  • Ensure robust manufacturability by applying DFM principles and maintaining alignment with quality and cost targets.
  • Generate key documentation: DFMEA, control plans, QFD, process FMEA, LAR plans , technical procurement spec etc.
  • Manage characterization and qualification phases to ensure design meets electrical, thermal, and reliability goals .
  • WBG packaging technology roadmap development/update.
2. NPI Project Management
  • Own project schedules, deliverables, and risk mitigation across all NPI phases.
  • Manage package prototyping/proof of concept, qualification, and transition to high volume manufacturing.
  • Lead technical reviews and gate milestones to ensure on-time development and HVM readiness.
  • Coordinate with cross-functional stakeholders (BU, quality, application, manufacturing) for technical alignment and execution.
  • Drive problem-solving processes (e.g., 8D, RCCA) to overcome design and process challenges.
  • Systematic approach in compliances with the NPI stipulated events/actions deliverable.
3. Leadership and Technical Influence
  • Mentor junior engineers and contribute to building a strong internal technical roadmap.
  • Support continuous improvement and best practice sharing across development teams.
  • Participate in customer technical discussions and support qualification/audit efforts where needed.
TECHNICAL SKILLS & COMPETENCIES
  • Minimum 5 years of experience in power module or high-power discrete package development, including hands-on NPI leadership.
  • Strong understanding of multiple disciplines in FOL processes including SiC wafer dicing, heated DA process application, Cu/Ag wire & ribbon bonding, Solder reflow, gel-filled modules, and thermal/electrical design considerations etc.
  • Ability to develop technology roadmap align with WBG packaging evolvement
TOP 5 GENERIC SKILLS & COMPETENCIES
  • Experience with device-package interaction , material selection, and reliability standards (e.g., JEDEC, AEC-Q100).
  • Skilled in the use of tools such as AutoCAD, JMP, Minitab , and proficiency in MS Office and technical presentations.
  • Strong communication and cross-functional collaboration skills.
  • Self-driven, open-minded, problem solver with a proactive mindset.
Risk based thinking in carrying out development roles.
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